3D Wafer Bump & Wire Bonding AOI Inspection System

Description

ZEUS: 3D Wafer Bump & Wire Bonding AOI Inspection system

 Highest quality 3D Wire-Inspection.
 With high-resolution, complete inspection is possible even for Foot-shape.
 Inspect Mirror-surface without Reflection problem.
 As for PEMTRON’S unique optical technology, Coaxial lighting was applied to 3D installation.
 All Packages including SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
 AOI + SPI Multi-Hybrid System.
 With high resolution quality, inspection of small and dense parts such as Bump, Mini LED, parts lower than 009004, etc. are optimized.