Description
Advanced Decapsulation System:
Proprietary Cu Decapsulation Process
• Specifically designed for processing integrated circuits
with copper wires.
• Targets the removal of a wide variety of mold
compounds while maintaining the integrity of sensitive
copper wires.
• Etches virtually any package with any wire thickness
• Produces results that facilitate a host of postdecapsulation
failure analysis tests.
Innovative Features of JetEtch Pro
• Industry-leading safety features
• Faster etch processing times
• Flexible etch head designs
• Superior pump longevity
• The most effective
software in the industry
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