Laser IC Decapsulation

Description

LE 1064 ETCHING
Laser decapsulation is a highly precise and effective method of removing plastic encapsulant material from a device. By using a 20W 1064nm laser, the encapsulant material is vaporized, eliminating the risk of accidentally destroying or washing away a defect with decapsulation chemicals. This method is particularly useful for small or oddly-shaped devices that would be challenging to expose chemically. Additionally, laser decapsulation reduces the need for chemical consumables. Our advanced in-line camera with laser technology enables simultaneous viewing and etching of devices. With a large optical zoom of 18x, our camera can view devices ranging from 1mm to 100mm in size. Experience precision and efficiency with our cutting-edge technology.

Laser Etch Highlights
 Proprietary Decapsulation Process
 Best Solution for Silver Wires
 Etches a Wide Variety of Package Types
 Wet Chemical-free Decap Eco-friendly
 Touchscreen Interface
 PC/Windows 10-based GUI
 Etches Samples with Cu, Au, Ag, Al Wire Types

Capabilities:

 Capable of decapsulating IC packages less than 1mm x 1mm
 Capable of decapuslating IC packages 10mm or thicker
 Capable of cutting IC packages
 Real-time video monitoring
 High Resolution Camera ≥ 2 Megapixels
 Camera optical zoom up to 18x
 Image saving
 Filtration System
 Compliant with class 10k cleanroom
 Equipped with HEPA filter with Extra Filter and carbon filter
 Fume extractor included
 Positionable exhaust inlet
 Integrated interface (e.g. power and sleep) or interlock with exhaust/filtration system

Specifications:

 High Quality Laser
 Air cooled 1065nm Fiber Laser
 Power: 20watts
 Pulse Width: adjustable 9ns-200ns
 Frequency: 1Khz-1Mhz
 Scanning Galvo
 Class Safety: Class1
 Zoom Lens : Large 18x Optical Zoom
 Camera: 8 megapix color
 Laser Pointer Focus Aid
 Optional: Motorized Z axis
 Optional: Motorized XYZ with Automated Jedec Tray Decapsulation
 Optional: Green Laser for Slicing