Magentic test Equipment for Sensors

Description

Magnetic Sensor Test Equipment:

Electrical Probing of Sensors Under Magnetic Field

Hprobe offers IC manufacturers with a turnkey solution that will accelerate magnetic SENSOR product development, ensuring a successful ramp-up.

Testing time is a key performance indicator in production and a strong added value to reduce development time. Building the optimal wafer test equipment dedicated to SENSOR technology and products, with maximum flexibility and shortest testing time, brings significant value during the development phase, and drastically reduces time-to-market (TTM) to high-volume manufacturing (HVM). Hprobe’ solutions fulfill the needs for both flexibility and performance, therein supporting engineers on their long road from technology release to production control and monitoring.

The sensors are measuring the magnetic field to extract information on the position, the angle, the strength, and the field direction. The outcome of this measurement is data related to the motion of a part or of a current flowing. To validate chip products for end applications, the test is done at wafer level by doing electrical probing while varying the magnetic field above the wafer.

The wafer-level test is done by:

Applying a fast-settled static magnetic field in any direction of space 1D, 2D or 3D and measuring the output electrical response of the sensor.

Applying a variable magnetic field swept fast in amplitude or angle to sort the products at high throughput, enabling full test coverage on the wafer while limiting the cost of test.