A method of joining parts by filling the space between assembled or close parts by capillary action using a filler material called solder that melts at 450? or lower – Widely used in the electronics industry as a joining method applicable to various metals and thicknesses – High-speed operation is possible through automated equipment configuration […]
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Archive for May 28th, 2025
Window Bonding
This is a bonding equipment that uses a 20W~100W diode laser .A new cover window bonding method has been applied to accommodate the thinning of smartphone bezels.By utilizing the characteristics of the laser, we provide bonding solutions specifically for smartphone cover windows and smartwatch cover windows.
Plastic Welding
This is a welding equipment that uses a 50W~500W direct diode laser.After pressing two plastic materials together, a laser beam is irradiated to achieve fusion. The bonding strength of the parts is excellent, and waterproofing and weight reduction are possible.It provides fusion solutions for everything from small sizes such as vehicle rear surveillance cameras to […]
Laser Welding
Laser power for welding machines uses Fiber (CW) 500W~6kW, Fiber (DDL) 1kW~6kW, and for welding of reflective materials or welding that requires spatter minimization, Dual beam core 4~6kW is applied to provide optimal welding quality. This is a welding equipment that uses a 500W~2kW Fiber laser. It implements the joining of metals and non-metals (Al, […]
BGA Rework Station – ZM-R5860 Hot Air
The system includes a high-definition touch screen for editing and storing temperature curves, a laser positioning guide for accurate component placement, and a vacuum suction pen for easy BGA handling.
Electricity Safety Tester
This device heats from 25°C to 1100°C with 1°C accuracy and features automated glow wire testing and specimen release after the test.
EMI and EMC Test Systems
This EMI measuring device detects frequencies from 9kHz to 1GHz, with a ±2 dB accuracy, multiple detection methods (PK, QP, AV), and connects to a PC via USB, compatible with Windows 7 to 11.
LED Test Instruments
This device measures wavelengths from 200nm to 3000nm, simulates human retinal optics, and uses a high-resolution CCD camera for radiance and irradiance measurements, with calibration traceable to NIM standards.
RoHS Tester – EDX-2A
The EDX-2 series energy-dispersive X-ray fluorescent spectrometer identifies elements in a sample by analyzing the wavelengths and intensities of emitted X-rays, allowing for the determination of each element’s content based on their spectral strengths.
Scanning Accoustic Microscopy
LPR Globals Scanning Acoustic Microscopes (SAM) reduce takt time by up to 20 times by incorporating high-speed scanning modules and improved equipment design. Scanner modules are equipped with multiple ultrasonic sensors for a shorter takt time, higher throughput, and precise scans. Scanning Acoustic Microscope Main Features Ultra-fast linear equipment with high acceleration results in high […]
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
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ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in