Archive for May 28th, 2025

CSM series is the wafer level chip scale marker for semiconductor and can mark on wafer backside without any chip damages.The equipment has an automated calibration system to compensate scanner accuracy and an automated marking inspection system to check the marking results.

The JL-D16 is primarily utilized for double-sided grinding or polishing of flat workpieces. It can also be employed for processing workpiece thicknesses, with a minimum achievable thickness of 0.4mm. Additionally, the surface precision can reach 0.3?m, ensuring a high level of machining accuracy. The innovative JL-D16 double-sided grinding machine combines both double-sided grinding and polishing […]

Hydrodynamic plain bearing:standard equipment for every model (Patented by HAMAI) Levitates the lower plate with the hydraulic force, thereby ensuring highly load-resistant, smooth, and vibration-free rotation of the plate. Plate flatness maintenance cycle:standard equipment for most of the machines. Rotates the carriers clockwise and counterclockwise alternately to maintain the flatness of the plate surface while […]

Tray marker for semiconductor can be manufactured as compact ‘U’ type and conventional “I” type.

The 4-beam strip marker for semiconductor can support both slot and stack magazine for loading & unloading. The strip handling is divided into two types, shuttle and rail types and the loading/unloading methods such as 1 in 1 out, 2 in 2 out and etc. can be configured in accordance with customers’ request.

BMC204P is a package drilling equipment for the strip and wafer types of POP.Its automatic inspection and scanner compensation feature make the process highly accurate.It adopts flying processing method to increase productivity.

LMC3200D is a dicing system for thin wafer of less than 200?.It is better than mechanical blade dicing system in terms of COO, sicne it doesn’t need to replace blade and the lifetime of laser parts is long and semipermanent.The non-contact process can dramatically reduce the problem of chipping and enable high-speed processing.

LMC3200G removes the low-k material and metal pattern layers on the wafer sawlane.It not only improves the yield rate but also reduces wafer chipping during the blade dicing processing.

Wafer Sorting by ID The marked ID-Code is read by a camera system. After that process step the wafer is automatically placed according the wafer ID in the cassette. There are following sorting modes: • Ascending/descending order • Split of wafers • Merge of wafers • Randomization of wafers • Individual sorting by host control […]