Die Bonders

The Die Bonder model PP6 is the most versatile semi-automatic Flip-Chip Platform.
• Designed for accurate placement of delicate devices on substrate
• It achieves high accuracy placement using high quality optical device.
• The machine provides for single collet vacuum pick and place of dies from waffle pack, wafer, Gel-Pak or bulk die media and features adjustable and repeatable subsonic scrub.
• All process capability.
• Flip Vision alignment for Small and large devices.
• A full automated die bonding sequence with according epoxy pattern are programmable Off-Line… a simple matrix or multiple locations as well.
• The PP6 is designed to be external vibration free.
• The PP6 is user friendly, flexible, and requires minimum training to operate.