ZEUS: 3D Wafer Bump & Wire Bonding AOI Inspection system
? Highest quality 3D Wire-Inspection.
? With high-resolution, complete inspection is possible even for Foot-shape.
? Inspect Mirror-surface without Reflection problem.
? As for PEMTRON’S unique optical technology, Coaxial lighting was applied to 3D installation.
? All Packages including SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
? AOI + SPI Multi-Hybrid System.
? With high resolution quality, inspection of small and dense parts such as Bump, Mini LED, parts lower than 009004, etc. are optimized.
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