Chandigarh Group of Colleges (CGC) Landran’s AICTE–IDEA Lab has formally signed a Memorandum of Understanding (MoU) with QMANSYS, the principal partner of HCP Technologies, marking a significant collaboration to bridge academic learning and industry practice. The partnership was formalized during a signing ceremony attended by Dr. Rajdeep Singh (Campus Director and Chief Mentor of the […]
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- Unlocking Future Innovators: Strategic Partnership with CGC Landran AICTE-IDEA Lab
- AICTE–JNNCE IDEA Lab MoU Signing | Industry–Academia Collaboration
- BNMIT Signs MoU with Qmansys Infosolutions to Strengthen Industry–Academia Collaboration
- Empowering Innovation: BFGI Signs MoU to Establish AICTE IDEA Lab
- Dhanalakshmi Srinivasan College of Engineering and Technology Signs MoU with HCP Technologies, Qmansys Infosolutions, and NASSCOM for the Establishment of AICTE IDEA Lab
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AICTE–JNNCE IDEA Lab MoU Signing | Industry–Academia Collaboration
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- January 7, 2026
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Jawaharlal Nehru New College of Engineering (JNNCE), Shivamogga, marked a major milestone on December 22, 2025, by signing strategic MoUs under the AICTE–JNNCE IDEA Lab. These partnerships connect students directly with industry leaders, providing practical training and real-world projects to boost skills and job readiness. Strong Industry Collaborations Qmansys Infosolutions LLP from New Delhi signed an […]
BNMIT Signs MoU with Qmansys Infosolutions to Strengthen Industry–Academia Collaboration
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- January 7, 2026
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BNM Institute of Technology (BNMIT), Bengaluru, has entered into a strategic Memorandum of Understanding (MoU) with Qmansys Infosolutions under the AICTE–BNMIT IDEA Lab initiative — marking a significant step toward bridging the gap between academia and industry. This collaboration aims to create a dynamic platform for students to engage in hands-on learning, live industrial projects, and expert mentorship from professionals in the field. Through […]
Empowering Innovation: BFGI Signs MoU to Establish AICTE IDEA Lab
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- January 7, 2026
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Baba Farid Group of Institutions (BFGI) is pleased to announce the signing of a Memorandum of Understanding (MOU) Qmansys Infosolutions, and NASSCOM for the establishment of the AICTE IDEA Lab at the BFGI Campus. This collaboration marks a significant milestone in fostering a culture of innovation, research, product development, and entrepreneurship among students and faculty members. The AICTE IDEA Lab initiative aims to provide […]
Dhanalakshmi Srinivasan College of Engineering and Technology Signs MoU with HCP Technologies, Qmansys Infosolutions, and NASSCOM for the Establishment of AICTE IDEA Lab
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- January 7, 2026
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Dhanalakshmi Srinivasan College of Engineering and Technology (DSCET), Mamallapuram, Chennai – 603104, is pleased to announce the signing of a Memorandum of Understanding (MoU) with HCP Technologies Private Limited, Qmansys Infosolutions, and NASSCOM for the establishment of an AICTE IDEA Lab on the college campus. This collaboration marks a significant milestone in DSCET’s continuous efforts to enhance its innovation and entrepreneurship ecosystem. The […]
HCP Technologies, Qmansys Info Solutions and NASSCOM join hands with KIET Group of Institutions to launch AICTE IDEA Lab
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- November 26, 2025
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We are delighted to announce that NASSCOM, Qmansys Info Solutions, and HCP Technologies have officially signed a Memorandum of Understanding (MoU) with KIET Group of Institutions to establish the AICTE IDEA Lab on the KIET campus. This strategic collaboration embodies a major step towards fostering robust industry-academia engagement, advancing startup ecosystems, and embedding experiential learning […]
SEMICON INDIA 2025
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- August 28, 2025
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We are excited to share moments from our participation at Semicon India 2025, held on SEP 2 – 4, 2025 | Yashobhoomi (IICC), New Delhi, one of the premier events in the semiconductor industry. This event provided a great platform for us to engage with industry leaders and showcase our complete range of Semiconductor Manufacturing […]
India Semiconductor and Packaging Ecosystem Conference (ISPEC) 2025
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- August 21, 2025
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We are delighted to share highlights from our participation at the India Semiconductor and Packaging Ecosystem Conference (ISPEC) 2025, held from March 5–7, 2025, at IIT Gandhinagar, Gujarat. The event brought together thought leaders, researchers, and industry experts to discuss advancements in semiconductor design, manufacturing, and packaging technologies. It served as an excellent platform for […]
14th Electronics Supply chain Summit 2025
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- August 21, 2025
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We are pleased to share that HCP Technologies participated in the Electronics Supply Chain Summit 2025, held on 18th & 19th February 2025 at Chennai Trade Centre, Chennai. The summit brought together industry leaders, innovators, and stakeholders from across the electronics ecosystem to discuss the latest trends, opportunities, and challenges shaping the global supply chain. […]
Semicon India 2024
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- August 21, 2025
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We are excited to share moments from our participation at Semicon India 2024, one of the premier events in the semiconductor industry. This event provided a great platform for us to engage with industry leaders and showcase our complete range of Semiconductor Manufacturing Solutions — from Front End Wafer Fab to Backend ATMP/OSAT Line. We […]
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