? Conduct with PASS Buffer when REWORK Part with Multiple NGs ? Function to start manufacturing with the REWORK Parts during INSPECTION ATM Check ? Apply the LOAD PORT substitute loading system during UNLOADER PART ATM inspection ? AIR CHUCK Works on Both 8-inch(200mm), 12inch(300mm) WAFER ? Users can output and monitor the designated DATA […]
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Scanning Accoustic Microscopy
LPR Globals Scanning Acoustic Microscopes (SAM) reduce takt time by up to 20 times by incorporating high-speed scanning modules and improved equipment design. Scanner modules are equipped with multiple ultrasonic sensors for a shorter takt time, higher throughput, and precise scans. Scanning Acoustic Microscope Main Features Ultra-fast linear equipment with high acceleration results in high […]
Thermal Vacuum Systems
Features: 36 Hr Auto Run with Preprogrammed Heating and Cooling Cycles Computer Controlled, Safety Interlocks Multiple Levels of Access with Passwords Chamber Size: 43 in Length and 24 in Diameter Sliding Thermal Platform of 16 x 32 Thermal Platform can be Heated to 150 °C and Cooled to -100 […]
Reactive Ion Etching System
-Substrate size & load capacity : 156mm*156mm wafer – 1 wafer/batch 6inch wafer 1wafer/batch -Molded heater for PECVD, wafer 400? -Water cooling chuck for RIE -RF power 600W 2set – Rotary pump (fomblin type) -Throttle valve + APC controller MFC: Ar(200sccm), O2(100sccm), SF6(100sccm), Cl2(100sccm), 10%SiH4-90%He(50sccm), N2(2slm), NH3(100sccm) PC control RIE &
Hot Wire CVD System
-Substrate size & load capacity : 4inch wafer – 1 wafer/batch – Source(gas) injection : Showerhead type -Molded heater, Wafer temp. 300?, up/down, rotation -W wire + Temperature controller -Dry pump -Throttle valve + APC controller – Bubbler(heating) 2set -MFC: Vapor MFC for bubbler 1ea, N2(300sccm), Ar(300sccm, 2ea), O2(300sccm) – Loadlock chamber -PC control
Wire Bonders
The WB100-e is designed as a multi-purposes semi automatic wire bond tool for R&D purpose, prototype and small series production. Flat bench Top size to allow easy carriage and operation. Optional, Full Manual Z mode for simple repair, not program dependent. Optional, Loop Profile. Higher z resolution and increased Z […]
Scriber
The Scriber Model S200 is easy to use for singulation of all component’s sizes. Robust and vibration free, the scriber is immediately operational, with minimum training. Vertical targeting is carried out with a video set including an electronic crosshair. The LCD screen allows the parameters display and selection through programming wheel. […]
Laser Stacker/ Tester
? The PP-Stacker Platform is designed for accurate Pick and Place of delicate devices, perfect tool for handling Laser Bars. ? Automated stacking and Unstacking of laser diode bar or laser bar. ? Specific Laser Bars ejector kit is used to pick the Bars directly from blue tape, gelpack or customized tray and places them […]
Wafer Marking
The InnoLas wafer marking systems are specially designed to mark semiconductor wafers with an individual code. This process serves to ensure the traceability of each individual wafer throughout the entire manufacturing process. In order to always obtain a homogeneous and clean marking process on a wide variety of materials, we use a laser specially developed […]
Wafer Sorting
Wafer Sorting by ID The marked ID-Code is read by a camera system. After that process step the wafer is automatically placed according the wafer ID in the cassette. There are following sorting modes: Ascending/descending order Split of wafers Merge of wafers Randomization of wafers Individual sorting by host control […]
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in