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Tray marker for semiconductor can be manufactured as compact ‘U’ type and conventional “I” type.

Wafer Sorting by ID The marked ID-Code is read by a camera system. After that process step the wafer is automatically placed according the wafer ID in the cassette. There are following sorting modes: • Ascending/descending order • Split of wafers • Merge of wafers • Randomization of wafers • Individual sorting by host control […]

The InnoLas wafer marking systems are specially designed to mark semiconductor wafers with an individual code. This process serves to ensure the traceability of each individual wafer throughout the entire manufacturing process. In order to always obtain a homogeneous and clean marking process on a wide variety of materials, we use a laser specially developed […]

?Themodel PP6ReworkStation isdesigned for accurateDieRemoval, BondArea Planner,SolderBallsRemovalandLocalVacuumCleaner,withoutstandingaccurate placement capabilityof delicatedevicesonsubstrateordeepPackages. (Optional Flip). ? PickandPlacefromWafer,fromWafflePack,Gel-PakorbulkDiemedia. ?PP6ReworkStationachievesaplacementaccuracybetterthan

? The PP-Stacker Platform is designed for accurate Pick and Place of delicate devices, perfect tool for handling Laser Bars. ? Automated stacking and Unstacking of laser diode bar or laser bar. ? Specific Laser Bars ejector kit is used to pick the Bars directly from blue tape, gelpack or customized tray and places them […]

• The Scriber Model S200 is easy to use for singulation of all component’s sizes. • Robust and vibration free, the scriber is immediately operational, with minimum training. • Vertical targeting is carried out with a video set including an electronic crosshair. • The LCD screen allows the parameters display and selection through programming wheel. […]

• The WB100-e is designed as a multi-purposes semi automatic wire bond tool for R&D purpose, prototype and small series production. • Flat bench Top size to allow easy carriage and operation. • Optional, Full Manual Z mode for simple repair, not program dependent. • Optional, Loop Profile. • Higher z resolution and increased Z […]

The Die Bonder model PP6 is the most versatile semi-automatic Flip-Chip Platform. • Designed for accurate placement of delicate devices on substrate • It achieves high accuracy placement using high quality optical device. • The machine provides for single collet vacuum pick and place of dies from waffle pack, wafer, Gel-Pak or bulk die media […]