Artificial Intelligence(AI) Inspection System Artificial Intelligence(AI) makes no need for additional parameter input process Intuitive and easy UI. This allows immediate utilization without operator education Accurate and Quick Inspection Counts from 0402 Size to Large Component such as Connector Simultaneous inspection can be proceed by automatically recognizing Reels from1 to 4 […]
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Inspection/Analysis Tools
Scanning Accoustic Microscopy
LPR Globals Scanning Acoustic Microscopes (SAM) reduce takt time by up to 20 times by incorporating high-speed scanning modules and improved equipment design. Scanner modules are equipped with multiple ultrasonic sensors for a shorter takt time, higher throughput, and precise scans. Scanning Acoustic Microscope Main Features Ultra-fast linear equipment with high acceleration results in high […]
3D Wafer Bump & Wire Bonding AOI Inspection system
ZEUS: 3D Wafer Bump & Wire Bonding AOI Inspection system ? Highest quality 3D Wire-Inspection. ? With high-resolution, complete inspection is possible even for Foot-shape. ? Inspect Mirror-surface without Reflection problem. ? As for PEMTRON’S unique optical technology, Coaxial lighting was applied to 3D installation. ? All Packages including SIP / FCBGA / FOWLP / […]
Wafer Bump 3D Vision Inspection
? Conduct with PASS Buffer when REWORK Part with Multiple NGs ? Function to start manufacturing with the REWORK Parts during INSPECTION ATM Check ? Apply the LOAD PORT substitute loading system during UNLOADER PART ATM inspection ? AIR CHUCK Works on Both 8-inch(200mm), 12inch(300mm) WAFER ? Users can output and monitor the designated DATA […]
Memory Module & SSD AVI(Automated Visual Inspection)
2D & 3D Inspection Process of Missing Part, Height, Tilt, Crack Part, PCB Crack, Solder Joint, Cold joint, Align, Solder Ball, Foreign Part, Angle, OCR Font, Barcode, Bridge and etc. Auto Inspection of Top and Bottom in Tray before final unloading of memory module process
Package AVI(Automated Visual Inspection) 10um
Inspection with 2D&3D of Ball Pith, Width, Height, Coplanarity, Bridge, Damage, Missing, align, Quality, Package Size, Chip out, FM, Scratch, Dent, Void, Mark, OCR, Barcode, Passive Elements. Auto inspection of Top, Bottom, side of JEDEC Tray before final unloading SMT process.
JetEtch IC Decapsulation
Dimensions Etcher unit (mm/in) 290 h x 290 w x 419 d / 11.5 h x 11.5 w x 16.5 d Bottle container, each unit (mm/in) 230 h x 110 w x 110 d / 9 h x 4.25 w x 4.25 d Weight (kg/lbs) 17 / 38 (excluding bottle container and accessories) Power 350 […]
Plasma/ Laser IC Decapsulation
Highly Customizable Etch Recipes Etches a Wide Variety of Package Types Completely Chemical-free Decap Eco-friendly Touchscreen Interface PC/Windows-based GUI The Only Solution for Silver Wires Etches Samples with All Wire Types Small Footprint Suited for Tabletop
Magnetic MRAM Test Equipment
The IBEX-WAT system operates with single or multi-channel configurations and is designed for Statistical Process Control (SPC) of the production yield at Wafer Acceptance Test (WAT), thanks to Process Control and Monitoring (PCM) of test structures. The system is using Hprobes exclusive technology of the magnetic field generator integrated into the test head, which is […]
Magnetic Sensor Test Equipment
The LINX-WS tester is dedicated to magnetic sensor chip sorting at wafer level. LINX-WS is using Hprobes proprietary technology of the magnetic field generator, integrated with a 3-axis robotized test head. It can operate with manually or automatically loaded probe cards. The field generation is driven by high performance instrumentation to achieve stable static or […]
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HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in