Semicon Back End Manufacturing Tools

CSM series is the wafer level chip scale marker for semiconductor and can mark on wafer backside without any chip damages.The equipment has an automated calibration system to compensate scanner accuracy and an automated marking inspection system to check the marking results.

The Die Bonder model PP6 is the most versatile semi-automatic Flip-Chip Platform. • Designed for accurate placement of delicate devices on substrate • It achieves high accuracy placement using high quality optical device. • The machine provides for single collet vacuum pick and place of dies from waffle pack, wafer, Gel-Pak or bulk die media […]

• The WB100-e is designed as a multi-purposes semi automatic wire bond tool for R&D purpose, prototype and small series production. • Flat bench Top size to allow easy carriage and operation. • Optional, Full Manual Z mode for simple repair, not program dependent. • Optional, Loop Profile. • Higher z resolution and increased Z […]

• The Scriber Model S200 is easy to use for singulation of all component’s sizes. • Robust and vibration free, the scriber is immediately operational, with minimum training. • Vertical targeting is carried out with a video set including an electronic crosshair. • The LCD screen allows the parameters display and selection through programming wheel. […]

? The PP-Stacker Platform is designed for accurate Pick and Place of delicate devices, perfect tool for handling Laser Bars. ? Automated stacking and Unstacking of laser diode bar or laser bar. ? Specific Laser Bars ejector kit is used to pick the Bars directly from blue tape, gelpack or customized tray and places them […]