– Substrate size & load capacity : 6inch wafer – 1 wafer/batch
-ICP source : RF 2kW
-Bias power : RF 600W
– Chuck cooling method : Chiller + He cooling (by EPC controller)
-TMP + Rotary pump
-Throttle valve + APC controller
-Baratron gauge + Convectron gauge
– MFC: SF6, CF4, CHF3, C4F8, CCl2, O2, He
– Loadlock chamber (stand-alone type)
-PC control
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
ICP-RIE System
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in
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