We are delighted to share highlights from our participation at the India Semiconductor and Packaging Ecosystem Conference (ISPEC) 2025, held from March 5–7, 2025, at IIT Gandhinagar, Gujarat.
The event brought together thought leaders, researchers, and industry experts to discuss advancements in semiconductor design, manufacturing, and packaging technologies. It served as an excellent platform for us to engage with stakeholders and showcase our comprehensive range of Semiconductor Manufacturing Solutions – from Front-End Wafer Fab to Backend ATMP/OSAT lines.
We also emphasized our strong global partnerships with leading OEMs including JFP Microtechnic (France), Nisene Technology (USA), Hamai (Japan), XTPL (Poland), Nanomaster (USA), Innolas (Germany), and more, reinforcing our commitment to enabling India’s growing semiconductor ecosystem.
Our team had insightful interactions during the conference, sharing knowledge, presenting advanced solutions, and exploring new avenues for collaboration. The moments captured below reflect the enthusiasm and active participation of our team at the event.
We look forward to continuing our efforts in advancing semiconductor and packaging technologies, while contributing to India’s vision of becoming a global semiconductor hub
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