LMC3200D is a dicing system for thin wafer of less than 200?.It is better than mechanical blade dicing system in terms of COO, sicne it doesnt need to replace blade and the lifetime of laser parts is long and semipermanent.The non-contact process can dramatically reduce the problem of chipping and enable high-speed processing.
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Laser Dicing
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31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in
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