BMC204P is a package drilling equipment for the strip and wafer types of POP.Its automatic inspection and scanner compensation feature make the process highly accurate.It adopts flying processing method to increase productivity.
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Laser Drilling
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in
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