LMC3200G removes the low-k material and metal pattern layers on the wafer sawlane.It not only improves the yield rate but also reduces wafer chipping during
the blade dicing processing.
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Laser Grooving
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in
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