2D & 3D Inspection Process of Missing Part, Height, Tilt, Crack Part, PCB Crack,
Solder Joint, Cold joint, Align, Solder Ball, Foreign Part, Angle, OCR Font, Barcode,
Bridge and etc.
Auto Inspection of Top and Bottom in Tray before final unloading of memory module
process
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Memory Module & SSD AVI(Automated Visual Inspection)
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in
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