Reactive Ion Etching System

-Substrate size & load capacity
: 156mm*156mm wafer – 1 wafer/batch
6inch wafer – 1wafer/batch
-Molded heater for PECVD, wafer 400?
-Water cooling chuck for RIE
-RF power 600W 2set
– Rotary pump (fomblin type)
-Throttle valve + APC controller
MFC: Ar(200sccm), O2(100sccm), SF6(100sccm), Cl2(100sccm),
10%SiH4-90%He(50sccm), N2(2slm), NH3(100sccm)
PC control
RIE &