?Themodel PP6ReworkStation isdesigned for accurateDieRemoval, BondArea Planner,SolderBallsRemovalandLocalVacuumCleaner,withoutstandingaccurate placement capabilityof delicatedevicesonsubstrateordeepPackages. (Optional Flip).
? PickandPlacefromWafer,fromWafflePack,Gel-PakorbulkDiemedia.
?PP6ReworkStationachievesaplacementaccuracybetterthan<5µm.
?Efficient die remover system, with dual action, including local Hot Gaz and adjustablesheareffect, compatiblewithverysmallDies (<200µm), inveryhighdensityHybridDevices.
?Adjustableroutineforsolderball removal, forsurfaceplannerandvacuumcleaner.
?Arobust,andreliablemechanicalconcept,designedtobeexternalvibrationfree.
? Easy touse, flexible, thePP6ReworkStation requiresonlyminimumtraining to operate.
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Rework Station
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in
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