Sputtering Systems

NANO-MASTER state-of-the-art fully automated Sputtering Systems come
with water cooled or heated (up to 700 °C) rotating 8” platen and up to three
off axis planar magnetrons. The system is pumped with a turbomolecular pump
and achieves mid 10-7 Torr base pressure. RF or DC power supplies can be
switched to multiple magnetrons by the use of an RF switch. Magnetron to
substrate distance is adjustable in order to achieve desired uniformity and
deposition rate. Rotating platen with off axis magnetrons provide means of
achieving the best film uniformity. Crystal thickness monitor is provided for
terminating process automatically.

Features:
• Stainless Steel, Aluminum or Bell Jar Chambers
• 70, 250 or 500 l/sec Turbomolecular Pump Backed with a Mechanical or Dry Pump
• 13.5 MHz, 300-600 W RF and 1 KW DC Power Supplies
• Crystal Holder with <1 Å Thickness Resolution • Door with View Port for Easy Wafer Load and Unload • PC Controlled with LabVIEW • Multiple Levels of Access with Password Protection • Fully Safety Interlocked Options: • Up, Down and Side Sputtering • RF, DC and Pulsed DC Sputtering • Co-Sputtering, Reactive Sputtering • Combinatorial Sputtering • RF or DC Bias (1000 V) • Heated Platen up to 700 °C • Thickness Monitor • Substrate RF Plasma Cleaning • Load Lock and Auto Wafer Load/Unload Applications: • Metal and Dielectric Coating of Wafers, Ceramics, Glass Blanks, Disk Heads • Optical and ITO Coatings • Hard Coatings with High Temperature Platens and Pulsed DC Power Supplies • Reactive Sputtering with RF Plasma Discharge