UPD for integration
- Facilitates seamless integration
- Provides flexibility and miniaturization for FHE, IC packaging, IoT systems, antennas, biosensors and more
Precision-driven microdots
- Controlled, precise dispensing of microdots below 10μm diameter
- Boosts performance in versatile scaling down of the IC packaging, system-on the chip designs
Reliable Connections -microwells filling
- Enables reliable connections, enhances thermal management and miniaturization
- Enhances functionality and performance for advanced packaging, flip-chip and TSV
- Variety of materials: conductive, dielectric, photoresist, QDots and more
Powering micro LED integration
- Facilitates control, driving and power dispensing of micro-LED displays
- Expands applications in AR/VR, smartwatches and automotive displays
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