This is a bonding equipment that uses a 20W~100W diode laser
.A new cover window bonding method has been applied to accommodate the thinning of smartphone bezels.By utilizing the characteristics of the laser, we provide bonding solutions specifically for smartphone cover windows and smartwatch cover windows.
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Mail ID : info@hcptech.in
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CALL US : 080 6646 8218
Window Bonding
HCP is driven by Six Essential Values that form the foundation of our company, holding it strong and resilient, much like the Hexagonal Close Packing unit cell.
GET IN TOUCH
ADDRESS:
31, 2nd Cross Rd, BOB Colony, JP Nagar 7th Phase, J. P. Nagar, Bengaluru, Karnataka 560078, India
CALL US :
080 6646 8218
Mail To :
info@hcptech.in
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