Wire Bonders

• The WB100-e is designed as a multi-purposes semi automatic wire bond tool for R&D purpose, prototype and small series production.
• Flat bench Top size to allow easy carriage and operation.
• Optional, Full Manual Z mode for simple repair, not program dependent.
• Optional, Loop Profile.
• Higher z resolution and increased Z travel for higher flexibility and sensitivity for very fine wire, required by worldwide laboratory requirements.
• Versatile wire bond tool.
• Perfect ergonomic design.
• Easy setup and high flexibility for multiple application.