Semicon Back End Manufacturing Tools

• The WB100-e is designed as a multi-purposes semi automatic wire bond tool for R&D purpose, prototype and small series production. • Flat bench Top size to allow easy carriage and operation. • Optional, Full Manual Z mode for simple repair, not program dependent. • Optional, Loop Profile. • Higher z resolution and increased Z […]

• The Scriber Model S200 is easy to use for singulation of all component’s sizes. • Robust and vibration free, the scriber is immediately operational, with minimum training. • Vertical targeting is carried out with a video set including an electronic crosshair. • The LCD screen allows the parameters display and selection through programming wheel. […]

? The PP-Stacker Platform is designed for accurate Pick and Place of delicate devices, perfect tool for handling Laser Bars. ? Automated stacking and Unstacking of laser diode bar or laser bar. ? Specific Laser Bars ejector kit is used to pick the Bars directly from blue tape, gelpack or customized tray and places them […]

?Themodel PP6ReworkStation isdesigned for accurateDieRemoval, BondArea Planner,SolderBallsRemovalandLocalVacuumCleaner,withoutstandingaccurate placement capabilityof delicatedevicesonsubstrateordeepPackages. (Optional Flip). ? PickandPlacefromWafer,fromWafflePack,Gel-PakorbulkDiemedia. ?PP6ReworkStationachievesaplacementaccuracybetterthan

The InnoLas wafer marking systems are specially designed to mark semiconductor wafers with an individual code. This process serves to ensure the traceability of each individual wafer throughout the entire manufacturing process. In order to always obtain a homogeneous and clean marking process on a wide variety of materials, we use a laser specially developed […]

Wafer Sorting by ID The marked ID-Code is read by a camera system. After that process step the wafer is automatically placed according the wafer ID in the cassette. There are following sorting modes: • Ascending/descending order • Split of wafers • Merge of wafers • Randomization of wafers • Individual sorting by host control […]

LMC3200G removes the low-k material and metal pattern layers on the wafer sawlane.It not only improves the yield rate but also reduces wafer chipping during the blade dicing processing.

LMC3200D is a dicing system for thin wafer of less than 200?.It is better than mechanical blade dicing system in terms of COO, sicne it doesn’t need to replace blade and the lifetime of laser parts is long and semipermanent.The non-contact process can dramatically reduce the problem of chipping and enable high-speed processing.

BMC204P is a package drilling equipment for the strip and wafer types of POP.Its automatic inspection and scanner compensation feature make the process highly accurate.It adopts flying processing method to increase productivity.

The 4-beam strip marker for semiconductor can support both slot and stack magazine for loading & unloading. The strip handling is divided into two types, shuttle and rail types and the loading/unloading methods such as 1 in 1 out, 2 in 2 out and etc. can be configured in accordance with customers’ request.